JPH0141257B2 - - Google Patents

Info

Publication number
JPH0141257B2
JPH0141257B2 JP691783A JP691783A JPH0141257B2 JP H0141257 B2 JPH0141257 B2 JP H0141257B2 JP 691783 A JP691783 A JP 691783A JP 691783 A JP691783 A JP 691783A JP H0141257 B2 JPH0141257 B2 JP H0141257B2
Authority
JP
Japan
Prior art keywords
conductor
connecting conductor
semiconductor device
flat semiconductor
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP691783A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59132632A (ja
Inventor
Tachio Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP691783A priority Critical patent/JPS59132632A/ja
Publication of JPS59132632A publication Critical patent/JPS59132632A/ja
Publication of JPH0141257B2 publication Critical patent/JPH0141257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP691783A 1983-01-19 1983-01-19 半導体素子の組込み方法 Granted JPS59132632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP691783A JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP691783A JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Publications (2)

Publication Number Publication Date
JPS59132632A JPS59132632A (ja) 1984-07-30
JPH0141257B2 true JPH0141257B2 (en]) 1989-09-04

Family

ID=11651581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP691783A Granted JPS59132632A (ja) 1983-01-19 1983-01-19 半導体素子の組込み方法

Country Status (1)

Country Link
JP (1) JPS59132632A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227696A (ja) * 2006-02-24 2007-09-06 Nichicon Corp 金属化フィルムコンデンサ
JP4895721B2 (ja) * 2006-08-22 2012-03-14 日立エーアイシー株式会社 アルミ電解コンデンサ

Also Published As

Publication number Publication date
JPS59132632A (ja) 1984-07-30

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